先進封裝設備之晶圓對位技術

從台積電推出InFO (Integrated Fan Out) 的先進封裝技術開始，半導體技術論壇，以及關相關專業研討會都脫離不了先進封裝扇出型封裝 (Fan Out Package)這項議題。雖然工研院機械所目前已開發晶圓級熱壓接合設備，然此設備開發時，即定調以製程驗證無需對位功能的著眼點進行研究開發，因此，如欲以此設備進行先進封裝，製程則需整合對位技術於此設備之中。藉由本次檢索先進封裝技術之對位技術，並綜合專利地圖分析及設備專利資料，本技術論文除提供讀者對該製程技術的技術掌握度之外，藉由專利分析，更可進一步強化相關技術開發能量。

Since the announcement of TSMC’s InFO (Integrated Fan Out) advanced packaging technology, semiconductor technology forums and professional seminars have been focused and inseparable from the topic of Fan Out Package (Fan Out Package). Although ITRI MMSL have successfully developed thermal compression bonding equipment, due to its original development standpoint focusing on process verification where alignment function is not required, the equipment is not suitable for such advanced package manufacturing process, in which process the wafer alignment function is required and plays an important role. In this article, patent analysis of the wafer alignment technology for the advanced packaging equipment is discussed with the goal to offer readers more understanding of the technology for the advanced package process equipment development.