IC 載板電漿設備之電極模組設計與軟體開發

因臺灣電路板產業客戶製程規格要求越來高，然而現有IC載板電漿處理設備，因整體電漿均勻度不佳(70~75％)，導致單片良率僅50~70％，片與片之間差異大及製程均勻度不佳(僅50~60％)，除造成整體材料成本提高外，唯有在製程均勻性的重新改善，才能實質提高循環經濟的價值。本文為IC載板電漿設備之電極模組設計與軟體開發，在電極模組設計上，透過特殊的流道設計及針對冷卻水路與氣流場進行分析模擬；在電控規劃設計上，主要包括系統主電源、訊號輸入與輸出、氣體流量、低頻電源、溫度傳感器、電磁閥等電控元件；在軟體開發上，其設備操作模式主要包含手動/自動模式、製程設定、各系統設定、資料查詢、異常紀錄、使用者管理功能等畫面。同時搭配技鼎的製程優化技術，進行高製程均勻性(>85%)的驗證，將有利推動IC載板電漿設備國產化，進而取代現有設備均勻度不佳及維修冗長困難等問題。

The process specification requirements of customers in Taiwan's printed circuit board industry are increasing. The plasma uniformity of existing IC substrate plasma processing equipment is poor (70-75%), leading to low single-chip yield, significant differences between wafers, and poor process uniformity (only 50-60%). Improving the uniformity of the process is necessary to increase the value of the circular economy without increasing the overall material cost. The purpose of this article is to discuss the design and software development of electrode modules for IC carrier plasma equipment. In electrode module design, special flow channels are created, analyzed, and simulated for cooling water channels and air flow fields. In electronic control planning and design, the main focus is on the main power supply, signal input and output, gas flow, low-frequency power supply, temperature sensor, solenoid valve, and other electronic control components. Manual and automated modes, process settings, system settings, data queries, exception records, user management functions, and other screens are among the equipment operation modes in software development. At the same time, by combining Premtek's process optimization technology, the verification of high process uniformity (>85%) will aid in the localization of IC substrate plasma equipment. Our objective is to substitute the current equipment problems of poor uniformity and lengthy and difficult maintenance with new ones.