高頻陶瓷元件雷射金屬化技術

摘要：隨著多樣性產品與元件對於輕薄短小之體積要求逐漸增加，微波介質陶瓷元件因具有體積小、元件密度高等優勢，而需求量大幅增加。本論文開發陶瓷雷射金屬化技術製作微波介質陶瓷元件應用於38GHz高頻天線與GPS （global positioning system）天線，以取代傳統銀漿網印技術與金屬漿料高溫燒結技術，其為低溫快速製程，且可利用雷射光精準控制金屬線路之位置與線寬，故最小線寬可達30 μm以下，且位置精度可控制於±50 μm以下，符合B4G或5G高頻模組之發展需求，且因低溫製程而具有高節能效益。

Abstract: Due to the increasing demands of various products and compact components, the needs to develop metallization technology in devices of microwave dielectric ceramics become imperative and important. The microwave dielectric ceramic is very effective for manufacturing smaller devices and improving the package density of integrated circuits. The purpose of this paper is to develop ceramic laser metallization technology to fabricate devices of microwave dielectric ceramics for the applications in high-frequency 38 GHz antenna and GPS antenna. In comparison to the conventional technology of screen printing of silver pastes sintered under high temperature, the laser metallization is a low-temperature process with rapid speed. Moreover, the position and line-width of metal lines could be precisely controlled by laser irradiation and stages. Therefore, the smallest line-width could be lower than 30 μm and the precision of line position could be within the range of ±50 μm. The achievement of smallest line-width and precision of line position fulfills the requirements of B4G and 5G high-frequency antenna. This technology could also effectively save energy because of its low-temperature process.

關鍵詞：陶瓷雷射金屬化技術、無電鍍、雷射、天線

Keywords：Ceramic Laser Metallization Technology, Electroless Plating, Laser, Antenna

前言
隨著3C產品及行動通訊市場高速成長，產品與元件對於輕薄短小之體積要求逐漸增加，根據IEK統計，2016年台灣微波介質陶瓷元件與被動元件產值達1233億元，年成長達5.4%。微波介質陶瓷元件因具有體積小、元件密度高等優勢，而需求量大幅增加，目前微波介質陶瓷元件可應用於微波頻段（主要是UHF（ultra high frequency）、SHF（super high frequency）頻段，300 MHz～300 GHz），可製作陶瓷天線、濾波器、陶瓷振盪器、介質導波迴路等陶瓷元件，如圖1所示。根據MarketsandMarkets Analysis市場調查機構統計，2009年全球微波介質陶瓷元件市場規模為68.2億美金，每年成長率超過15%，於2015年全球微波介質陶瓷元件市場規模將超過158.7億美元，需求量達63.4億個元件，其中，以GPS天線市場產值為最高，並隨著未來B4G/5G高頻產品增加與產品體積縮小，全球微波介質陶瓷元件將持續提高市場規模與產值。