- 回首頁
- 研究與發展
研究與發展
零組件配適優化分析模組 2023/07/12
簡介 Introductions
- 透過組裝公差演算分析優化模型,結合產線檢測作業之尺寸資訊擷取,計算並提供最佳品質組裝指南,解決傳統組裝作業常遭遇組裝尺寸不合,只能換取工件再組裝或現場手工修調之問題。可降低組裝重工時間,同時提升產品組裝品質一致性。
- The module provide the assembly guide via capturing the dimensional information from production line and calculating the best assembly quality through optimization algorithm, , and reduces the repair/rework problems encountered at the traditional assembly operation. The module can reduce assembly rework time and improve consistency of assembly quality.
特色與創新 Characters and Innovations
- 提供組裝配適建議,降低修配/重工機率。
- 提升組裝品質一致性 。
- 提高製造公差外廢品利用率 。
- 支援藍芽(無線)量測資訊傳輸,並可整合自動量測模組(接觸/非接觸) 。
- Provide suggestions for assembly and reduce the probability of repair/rework.
- Improve assembly quality and consistency.
- Increase the utilization rate of workpieces beyond manufacturing tolerances.
- Supports Bluetooth measurement data transmission, and can easily integrate automatic contact or non-contact measurement modules.
應用與效益 Applications and Benefits
- 產品生產之組裝品質優化。
- Optimization of assembly quality in manufacturing.
聯絡 contact
- 謝伯璜 Po-Huang Shieh
- E-mail: TabShieh@itri.org.tw
- TEL:886-3-5918076
- FAX:886-3-5820451
更多資訊