晶圓級探針卡技術 2022/07/20

簡介 Introductions

開發 3D 陶瓷電路板及微機電探針，取代環氧樹酯探針，探針精微化容易，提高一次測試晶粒數 (16 → 30 或32)。結合微機電探針製程可發展模組化探針組裝技術，可將探針組裝由單根 / 次大幅提升百根 / 次以上，大幅減少組裝人力與成本。

ITRI developed 3D ceramic circuit boards and MEMS probes to replace epoxy resin ring probes. The probes could reach fine pitch and increase the testing grains (16 → 30 or 32) at the same time. Combined with the MEMS probe process, ITRI developed the modular probe assembly technology, which can massively increase the probe assembly effiency from a single probe per time to more than one hundred probes per time, greatly reducing assembly labor and costs. 

特色與創新 Characters and Innovations

• 結合雷射圖案化與高選擇性金屬化技術，於 3D 陶瓷表面製作 3D 金屬線路，具有低成本與高彈性優勢。
• 發展高硬度三元合金金屬化技術 ( 硬度 ≥ 800HV)，進行微機電探針製作。
• 開發高精度積體化 3D 探針接合技術與雙面對準接合設備，進行模組化百根探針以上接合。
• Combining laser patterning and high-selective metallization technology, 3D metal circuits can be fabricated on the 3D ceramic surface, which has the advantages of low cost and high customization ability.
• Develop high-hardness ternary alloy metallization technology (hardness ≥ 800 HV), and applied to fabricating MEMS probes.
• Develop high-precision integrated 3D probe bonding technology and double-sided alignment bonding equipment to perform modular bonding of more than 100 probes.

應用與效益 Applications and Benefits

• 水平式探針卡、微機電探針、3D 陶瓷電路板
• Horizontal probe card, MEMS probe, 3D ceramic circuit board.

聯絡 contact

• 黃萌祺 Meng-Chi Huang
• E-mail: ach@itri.org.tw
• TEL:886-3-5915841
• FAX:886-3-5820043

更多資訊

• 更多技術介紹：https://www.automan.tw/aboutus/annual-report.aspx
• YouTube技術影片：https://www.youtube.com/channel/UCU3037vDY8r0m_rJ_U7lHvQ

三階MEMS 探針