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積層式3D 電路元件製造技術 2022/07/20

積層式3D 電路元件製造技術
 

簡介 Introductions

開發雷射誘導金屬化技術 (Laser Induced Metallization, LIM),利用奈米觸發膠體材料,輔以噴塗技術,可於任何3D/2D 基材表面佈植高濃度之活性粒子,以完成金屬圖案化結構,故不受基材之限制,而能應用於高分子、陶瓷、玻璃、金屬等基板上,最小線寬可達 30μm。所開發之觸發膠體可同時為絕緣層與觸發層,故可進行積層式 3D線路之製作。

ITRI developed Laser Induced Metallization (LIM) technology, by integrate nano-inducible colloid materials with 3D spraying technology, the high-concentration active particles could deposit on any 3D/2D surface to complete metal patterned structures. The LIM technology could apply on any substrate materials, including polymers, ceramics, glass, and metals, and the minimum line width reaches 30 μm. Moreover, the nano-inducible colloid can be both insulating layer and inducible layer, so it can be applied for fabricating multi-layer 3D circuits.

特色與創新 Characters and Innovations

  • 雷射誘導金屬化技術能製作『積層式 3D 天線』 ,可有效縮小天線面積,解決未來手機天線可用空間不足的瓶頸。
  • 雷射誘導金屬化技術因可製作於多種基材上,能應用於玻璃手機天線、5G MIMO 高頻天線等。
  • 能於 3D 陶瓷表面製作金屬線路,且能於高深寬比 10之孔內完成金屬層製作。
  • LIM technology can produce "multilayer 3D antenna", which can effectively reduce the antenna area and solve the bottleneck of insufficient space for mobile phone antennas in the future.
  • LIM technology can be fabricated on various substrate material, and can be applied to glass mobile phone antennas, 5G MIMO high-frequency antennas, etc.
  • Capable of fabricating metal circuit on 3D ceramic surface, and can complete metal layer in high aspect ratio (AR: 10) vias.

應用與效益 Applications and Benefits

  • 玻璃手機天線、5G 高頻天線、陶瓷天線、車用電子與感測器。
  • Glass mobile phone antennas, 5G high frequency antennas, ceramic antennas, automotive electronics and sensors.

聯絡 contact

  • 黃萌祺 Meng-Chi Huang
  • E-mail: ach@itri.org.tw
  • TEL:886-3-5915841
  • FAX:886-3-5820043

更多資訊

 

3D電路元件

雷射誘發3D電路製作技術

工研院機械所積層式3D線路技術