簡介 Introductions
晶圓機器人目前市場規模約8.1億美元，預估2025年將達10.3億美元，而隨著半導體產業不斷擴張，晶圓機器人的需求與性能要求也隨之增加，本技術開發了高速且低振動控制機器人以及採用嵌入式控制系統，電控組件與機器人為一體式設計，有效提升機器人整合至EFEM中之空間利用率，並解決維修不便、電磁干擾等問題。
The current market size of wafer robots is approximately US$810 million, and is expected to reach US$1.03 billion in 2025. As the semiconductor industry continues to expand, the demand and performance requirements for wafer robots have also increased. This technology develops high-speed and low-vibration control robots and adopts an embedded control system. The electronic control components and the robot are integrated into the design, which effectively improves the space utilization of the robot integrated into the EFEM and solves problems such as inconvenient maintenance and electromagnetic interference.
特色與創新 Characters and Innovations
- 高速控制技術，WPH達250。
- 振控制技術，振動值＜0.3g。
- 動監控功能，牙叉埋入式振動感測器，與控制器整合，能有效監控振動值，並且在運動過程中進行控制路徑彈性調變。
- 嵌入式控制器設計，空間利用率提升，維修難度降低，電磁干擾降低。
- 彈性化運動路徑規劃與控制。