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積層式3D電路元件製造技術 2023/07/11

簡介 Introductions

開發雷射誘導金屬化技術 (Laser Induced Metallization, LIM)，利用奈米觸發膠體材料，輔以噴塗技術，可於任何 3D/2D 基材表面佈植高濃度之活性粒子，以完成金屬圖案化結構，故不受基材之限制，而能應用於高分子、陶瓷、玻璃、金屬等基板上，最小線寬可達30 µm。所開發之觸發膠體可同時為絕緣層與觸發層，故可進行積層式 3D 線路之製作。

The Laser Induced Metallization (LIM) technology has been developed with the use of laser-triggered colloidal Nanomaterials and is supplemented with spraying technology, which can implant high concentrations of active nanoparticles on any 3D/2D curved surface to create metal patterned structures. Therefore, it is not limited by the substrate materials and can be applied to polymer, ceramic, glass, metal and other substrates with a minimum line width of 30µm. The developed trigger colloid can simultaneously serve as an insulating layer and a triggering layer, making it possible to produce layered 3D circuitry.

特色與創新 Characters and Innovations

雷射誘導金屬化技術能製作『積層式 3D 天線』，可有效縮小天線面積，解決未來手機天線可用空間不足的瓶頸。
雷射誘導金屬化技術因可製作於多種基材上，能應用於玻璃手機天線、5G MIMO 高頻天線等。
能於 3D 陶瓷表面製作3D金屬線路，且能於高深寬比10 之孔內完成金屬層製作。
LIM technology can produce a "multilayer 3D antenna", which can effectively reduce the antenna area and solve the bottleneck of insufficient space for mobile phone antennas in the future.
LIM technology can be fabricated onto various substrate materials, and can be applied to glass mobile phone antennas, 5G MIMO high-frequency antennas, and more.
Capable of fabricating metal circuit on 3D ceramic surface, and can complete metal layer in high aspect ratio (AR: 10) vias.

應用與效益 Applications and Benefits